Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys

Ayodele Olofinjana; Rezwanul Haque; Mashdalina Mathir; Nyuk Yoog Voo

doi:10.1016/j.promfg.2019.02.084

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Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys

Journal article

Open access

Peer reviewed

Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys

Ayodele Olofinjana, Rezwanul Haque, Mashdalina Mathir and Nyuk Yoog Voo

Procedia Manufacturing, Vol.30, pp.596-603

Global Congress on Manufacturing and Management (GCMM-2018), 14th (Brisbane, Australia, 05-Dec-2018–07-Dec-2018)

2019

DOI: https://doi.org/10.1016/j.promfg.2019.02.084

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Abstract

soldering

lead-free solder

SAC

DSC

primary phase

Sn-Ag-Cu alloy

Because of the environmental health implications of Pb, and legislation backing Restriction on Hazardous Substances (RoHS) in electronic devices, Sn-based lead-free solders are developed. Near eutectic Sn-Ag-Cu (SAC) compositions is the most widely used Pb-free solder in the electronic industries. However, its high melting temperatures (>217 â„ƒ) remains a concern. The addition of Bi to a Sn-based alloy can be used to lower melting temperature because of the presence of a deep valley eutectic in the Bi-Sn system. The effects of such additions in SAC on solidification path are rarely considered. The effects of Bi substitution for Sn on solidification of near eutectic SAC alloy are followed with differential thermal analysis (DSC). It is found that the solidus temperature of SAC-Bi alloy mixes is considerably lowered. For low concentrations of Bi, melting range (ΔTr) were generally less than 4 â„ƒ. However, (ΔTr) considerably widens when the Bi content exceeds 2 wt. %. The DSC and X-ray diffraction (XRD) studies suggested that a higher concentration of Bi in SAC would lead to far eutectic solidification that is attended by a formation of primary Bi phase. The existence of primary Bi phase in a solidified solder would lead to embrittlement and thus would affect the integrity of soldered joints. This work suggests that the use of Bi in SAC solders should be restricted to less than 2 wt. % (by varying %Wt of Bi).

Details

Title: Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys
Authors: Ayodele Olofinjana (Author) - University of the Sunshine Coast - School of Science and Engineering
Rezwanul Haque (Author) - University of the Sunshine Coast - School of Science and Engineering
Mashdalina Mathir (Author) - Universiti Brunei Darussalam, Darussalam
Nyuk Yoog Voo (Author) - Universiti Brunei Darussalam, Darussalam
Publication details: Procedia Manufacturing, Vol.30, pp.596-603
Conference details: Global Congress on Manufacturing and Management (GCMM-2018), 14th (Brisbane, Australia, 05-Dec-2018–07-Dec-2018)
Publisher: Elsevier BV
Date published: 2019
DOI: 10.1016/j.promfg.2019.02.084
ISSN: 2351-9789
Organisation Unit: School of Science and Engineering - Legacy; University of the Sunshine Coast, Queensland; School of Science, Technology and Engineering
Language: English
Record Identifier: 99451433802621
Output Type: Journal article

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Collaboration types: Domestic collaboration; International collaboration
Web Of Science research areas: Engineering, Manufacturing; Green & Sustainable Science & Technology