Logo image
Low temperature bonding of ceramics by sol-gel processing
Journal article   Peer reviewed

Low temperature bonding of ceramics by sol-gel processing

C J Barbé, D J Cassidy, G Triani, B A Latella, D R G Mitchell, K S Finnie, John R Bartlett, J L Woolfrey and G A Collins
Journal of Sol-Gel Science and Technology, Vol.19(1-3), pp.321-324
2000
url
https://doi.org/10.1023/A:1008733632163View
Published Version

Abstract

Materials Engineering sol-gel films bonding silica alumina spincoating
Sol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by spin-coating solutions containing partially hydrolysed silicon alkoxides onto both substrates. The two coated substrates were assembled and the resulting sandwich was fired at temperatures ranging from 300 to 600°C. The influence of the sol-gel chemistry on the film microstructure and interfacial fracture energy was investigated using a wide range of techniques, including ellipsometry, FTIR, TG-DTA, rheology, TEM and micro-indentation. For silicon wafers, an optimum water-alkoxide molar ratio of 10 and hydrolysis water pH of 2 were found. Such conditions led to relatively dense films (>90%), resulting in bonds with significantly higher fracture energy (3.5 J/m2) than those obtained using classical water bonding (typically 1.5 J/m2). Aging of the coating solution was found to decrease the bond strength. Poly-crystalline alumina substrates were similarly bonded at 600°C; the optimised silica sol-gel chemistry yielded interfaces with fracture energy of 4 J/m2.

Details

Metrics

4 File views/ downloads
1393 Record Views

InCites Highlights

These are selected metrics from InCites Benchmarking & Analytics tool, related to this output

Web Of Science research areas
Materials Science, Ceramics
Logo image