Sign in
Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application
Journal article   Peer reviewed

Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application

Congnan Guo, Tengfei Yi, Jeffrey J Morrell, Wei Gao, Sisi Zhao, Ke Zhan, Long Yang and Guanben Du
Journal of Wood Chemistry and Technology, Vol.39(5), pp.372-383
2019
url
https://doi.org/10.1080/02773813.2019.1636822View
Published Version

Abstract

phenol-formaldehyde resin nano cupric oxide curing kinetics oriented strandboard physical and mechancial properties morphological analysis

Details

Metrics

InCites Highlights

These are selected metrics from InCites Benchmarking & Analytics tool, related to this output

Collaboration types
Domestic collaboration
International collaboration
Web Of Science research areas
Materials Science, Paper & Wood
Logo image