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Low-temperature bonding of ceramics by sol-gel processing
Conference paper   Peer reviewed

Low-temperature bonding of ceramics by sol-gel processing

C J Barbé, D J Cassidy, G Triani, B A Latella, D R G Mitchell, A Day, K Short, John R Bartlett, J L Woolfrey and G A Collins
Materials Research Society Symposium Proceedings, Vol.587, pp.O4.6.1-O4.6.7
Materials Research Society Fall Meeting: Substrate engineering paving the way to epitaxy, 1999 (Boston, United States, 29-Nov-1999–03-Dec-1999)
Materials Research Society
1999
url
https://doi.org/10.1557/PROC-587-O4.6View
Published Version

Abstract

Macromolecular and Materials Chemistry
Sol-gel bonding was produced between smooth, clean substrates of silicon and polycrystalline alumina by spin-coating solutions containing partially hydrolyzed silicon alkoxides. The two coated-substrates were assembled and the resulting sandwich was fired at temperatures ranging from 300 to 600 °C. The coatings and bonded substrates were investigated using SEM, TEM and micro-indentation. For silicon wafers, an optimum water-to-alkoxide molar ratio of 10 and hydrolysis water pH of 2 was found. Such conditions led to relatively dense films (>90%), resulting in bonds with a fracture energy of 3.5 J/m 2, which is significantly higher than those obtained using hydrophilic wafer bonding (typically 1.5 J/m 2). Poly-crystalline alumina substrates were similarly bonded at 600 °C; the optimized silica sol-gel chemistry yielded interfaces with fracture energy of 4 J/m 2.

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