Examine temperature field at sealing surfaces treated by laser sealing using Ansys software

Trong Tuan Nguyen; Tat Thang Nguyen; Ngoc Hoan Le; Quoc Huy To; Jun Hua

doi:10.1088/1757-899X/452/2/022010

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Examine temperature field at sealing surfaces treated by laser sealing using Ansys software

Conference paper

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Examine temperature field at sealing surfaces treated by laser sealing using Ansys software

Trong Tuan Nguyen, Tat Thang Nguyen, Ngoc Hoan Le, Quoc Huy To and Jun Hua

IOP Conference Series: Materials Science and Engineering, Vol.452(2), pp.1-10

International Conference on Insulating Materials, Material Application and Electrical Engineering (IMMAEE), 3rd (Melbourne, Australia, 15-Sep-2018–16-Sep-2018)

Institute of Physics Publishing Ltd.

2018

DOI: https://doi.org/10.1088/1757-899X/452/2/022010

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Abstract

Upon deposition of laser irradiation on sealing surface, energy build-up heats up the structural radiation area, significantly and rapidly changing the mechanical properties of the materials in the irradiated area. Consequently, the change of material properties leads to the liquidation of the radiated surfaces which is responsible for the binding efficacy of EVA glue. It is therefore important to investigate the temperature field during the transient sealing period. In our study we demonstrate a method of temperature field investigation by finite element analysis using Ansys software. Threedimensional finite element simulation is employed to investigate the temperature fields and heat flux in a 0.2mm-thick adhesive layer on surface of a sealing edge with total thickness of 0.5mm x 22mm width. The laser beam was emitted by a device with laser power of 3kw, scanning speed 100mm/s, 980nm wavelength, induced temperature ranging from 100o C to 160o C. Results proved optimal temperature of 135o C, inducing total heat flux of 8731.8 w/m2 which is suitable for melting adhesive for optimized binding efficacy. Our study introduced the optimal temperature, heat flux generated by the laser beam yet retaining performance of adhesive, as well as ascertaining binding efficacy and durable linkage between EVA glue and surface of wooden boards.

Details

Title: Examine temperature field at sealing surfaces treated by laser sealing using Ansys software
Authors: Trong Tuan Nguyen (Author) - Northeast Forestry University, China
Tat Thang Nguyen (Author) - Northeast Forestry University, China
Ngoc Hoan Le (Author) - University of the Sunshine Coast - Faculty of Arts, Business and Law
Quoc Huy To (Author) - Vietnam Academy of Forest Sciences, Vietnam
Jun Hua (Author) - Northeast Forestry University, China
Publication details: IOP Conference Series: Materials Science and Engineering, Vol.452(2), pp.1-10
Conference details: International Conference on Insulating Materials, Material Application and Electrical Engineering (IMMAEE), 3rd (Melbourne, Australia, 15-Sep-2018–16-Sep-2018)
Publisher: Institute of Physics Publishing Ltd.
Date published: 2018
DOI: 10.1088/1757-899X/452/2/022010
Copyright note: Copyright ©. Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd
Organisation Unit: University of the Sunshine Coast, Queensland; USC Business School - Legacy; Forest Industries Research Centre
Language: English
Record Identifier: 99450992802621
Output Type: Conference paper

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